New software - Version 3.77

Software update notifications
Dataman (Daniel Smith)
Posts: 2131
Joined: 09 Nov 2011 14:36

New software - Version 3.77

Postby Dataman (Daniel Smith) » 14 Jun 2022 10:13

Dear Dataman users,

New software has just been posted on our software pages for the Dataman 448Pro2AP-AU gang programmer with built-in actuation unit.

Version 3.77 features the following amendments:

New Device Support
Many new devices have been added in this revision, please download the full device list to verify your chip is supported: Dataman448Pro2AP-AUDeviceList.pdf

Major Changes
Fixed CRC-CCITT and CRC-XMODEM checksum calculation
PG4UW: General Options/Job Report, changed checksum type used in file name
PG4UWMC: General Options/Job Report, file name generation options extended

Other Changes
Added module: AP1 BGA176-3.1 ZIF STM32H7-1
Added module: AP1 QFN56-1.02 ZIF RTL-1
Added module: AP1 QFP176-1.02 ZIF R7FA-1
Added module: AP1 SSOP28-200 ZIF PIC-2
Added module: AP1 TQFP64 ZIF PIC-3
Anlogic SALELF2 Erase+SVF, improving of erase action for devices with specific initial content
Atmel AT90S/LS4434 [PLCC44], insertion test modified
Atmel AT90S/LS4434 [TQFP44], AT90S/LS8535 [TQFP44], AT90S/LS2333/4433 [TQFP32], added new programming adapter option, insertion test modified
Atmel ATmega163 [TQFP44], added new programming adapter option, insertion test modified
Atmel ATmega323 [TQFP44], insertion test modified
Atmel/Microchip ATmega16/32 [TQFP44], insertion test modified
Atmel/Microchip ATtiny2313/4313, Device info updated
Boya Micro BY25D40A, setting Protected memory modified
cFeon(Eon Si.Sol.) EN25E40A(2A), setting Protected memory modified
Eon Silicon Sol. EN25E40A(2A), setting Protected memory modified
ESMT EN25E40A(2A), setting Protected memory modified
First-Rank Techn. T25S40-PB, setting Protected memory modified
GigaDevice GD55LB02GE, GD55B02GE, GD55X02GE, GD55LX01GE, GD55LB01GE, GD55T01GE, GD55X01GE, GD55B01GE, GD55B512MEFxR, GD25F256F, GD25Q256E, GD25Q256D, GD25LX256E, GD25LB256E, GD25LF255E, GD25LE255E, GD25Q257D, GD25LT256E, GD25Q256C, GD25B256D, GD25S513MD, GD25Q41B, GD25VQ41B, GD25WD10C, GD25D10B, GD25D10C, setting Protected memory modified
Macronix MX25L64356 [SOP16] (Quad I/O), MX25L64356 [SOP16], alternative programming module AP1 SOIC16 ZIF 300mil SFlash-1b acceptance added
Microchip PIC18F15Q40 [VQFN20 3x3], added support
Microchip SST26WF064C [SOIC16] (QuadSPI), alternative programming module AP1 SOIC16 ZIF 300mil SFlash-1b acceptance added
Microchip/Atmel ATF16V8C, ATF16LV8C, improving of read routine with possible impact to a device ID code
Mitsubishi/Renesas M38039FF (ISP-SCI), power-up and device info modified
Samsung KLMBG2JETD-B041 [FBGA153], added support PRV 0.3
Samsung KLMxGxJETD-B041 [FBGA153], stability of reading/verifying device improved
Silicon Laborat. MGM210P module, Device info modified
Silicon Works SW31100 [LQFP64], test ECC flags added
SST SST25VF032B [SOIC16], alternative programming module AP1 SOIC16 ZIF 300mil SFlash-1b acceptance added
Winbond W25Q16FWxxxQ, Alt+S menu improved, LBO bit removed
Wisekey, InsideSecure AT90SCR100LSD/200LSD [QFN32], package drawing updated
XMC XM25QU256B, XM25QH256B, setting Protected memory modified
Zetta ZD25Q16B, ZD25WD40B, setting Protected memory modified

Bug Fixes
Infineon XDPE12284C [QFN40] (Single Config.), LAN communication error bug fixed
Lattice LAXP2-5E/8E [csBGA132], LAXP2-5E/8E/17E [ftBGA256], pgm adapter assignment bug fixed
Microchip SST26WF064C [SOIC16] (QuadSPI), pinout bug fixed
Micronas HAR3735/3736, Miscalculation when entering CLAMP LOW hex register higher then 7FFFh bug fixed
Mitsubishi/Renesas M38039FF (ISP-SCI), communication speed setting bug fixed
NAND flash devices, binary file load, fixed file size/start/end values display
Winbond W25Q256JVxxQ [SOIC16] (QuadSPI), W25Q256JVxxM-DTR [SOIC16], W25Q256JVxxM-DTR [SOIC16] (QuadSPI), W25Q256JVxxM [SOIC16], W25Q256JVxxM [SOIC16] (QuadSPI), pinout bug fixed

Best regards,

Daniel Smith

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