Page 1 of 1

New software - Version 4.14

Posted: 08 Sep 2026 15:07
by Dataman (Daniel Smith)
Dear Dataman users,

New software has just been posted on our software pages for the Dataman 448Pro2AP super fast industrial gang programmer.

Version 4.14 features the following amendments:

New Device Support
Many new devices have been added in this revision, please download the full device list to verify your chip is supported: Dataman448Pro2APDeviceList.pdf

Major Changes

Other Changes
Added module: AP1 BGA256-2.1 ZIF PLD-8
Added module: AP1 BGA324-2 ZIF PLD-2
Added module: AP1 BGA484-2 ZIF PLD-1
Added module: AP1 QFN48 ZIF LASC-1
Added module: AP1 QFN48-2.02 ZIF TPS53-2
Added module: AP1 QFN56-1.02 ZIF ISL-1
Added module: AP1 QFN56-1.02 ZIF MP-21
Added module: AP1 QFN56-1.02 ZIF XDPE-3
Added module: AP1 QFP32-1.04 ZIF R7FA-3
Added module: AP1 QFP64-1.02 ZIF R7FA-7
Added module: AP1 TSSOP20-170 ZIF R7FA-1
Added module: AP1 TSOP56.2 ZIF 18.4mm NOR-1
AP1 QFN8-3a ZIF SFlash-1, write name to log modified
Axcen SFP (ISP), Device info updated
Epson S1C17 series, insertion test modified
Epson S1C17602/604 [TQFP14-100], Power-on sequence modified
Epson S1C17621 [TQFP14-100], Power-on sequence modified
Epson S1C17622/624 [TQFP15-128], Power-on sequence modified
Epson S1C17711 [TQFP15-128], Power-on sequence modified
GigaDevice GD25Q127C, programming/verifying of Status Register improved
GigaDevice GD25Q80E [SOP8-150] (QuadSPI), power-up sequence modified
Infineon CYT4DNJBRCQ1BZSGS [BGA327], verify procedure modified
Infineon CYTxxxx, programming procedure modified
Intel/Altera MAX 10, improving of pgm parameters
Micron MT25QU02GCBB8E12 [TBGA24] (Quad I/O), power-up sequence improved
MPS MP5998, improved support for chip revision 4
NAND flash devices, unified terminology with the ONFI standard (device, target, LUN...)
NXP LPC5536, device ID check modified
NXP MC99S12XD, XT algorithms improvements
NXP TEA2017AAT/2, added support of *.mif file
OneNAND flash devices, operations stability improved
Renesas/IDT 5P49V6975A000, Blank Check procedure improved
SanDisk SDINBDA6-xxG-xA, added option to resize the BOOT partition
Serial NAND flash devices, added support of Check invalid blocks operation
Texas Instruments MSPM0Lx227 [LQFP48], MSPM0Lx228 [LQFP48], added ID recognition for automotive parts(Q1 suffix)
Winbond W25Q256JVxxQ, Read operation improvement

Bug Fixes
ABOV HART-m320 (ISP-SWD), power-up procedure bug fixed
Epson S1C17 series, programmer communication error bug fixed
Epson S1C17701/4 [VFBGA7H-161], pinout bug fixed
Epson S1C17621 [TQFP14-100], Programming and Erase error bug fixed
Epson S1C17801 [TQFP15-128], pinout bug fixed
Lattice ispPAC-POWR605, pinout and insertion test bug fixed
Microchip PIC18FxxQ83 devices, *.hex file loading bug fix
Serial NAND flash devices, fixed OTP lock evaluation for multi target devices
STMicroelectronics M24128-DRMF3 [WFDFPN8], programming bug fixed
STMicroelectronics STM32F401xEx in ZIF mode, "Debug mode error: unknown interface initialization!" error fixed
STMicroelectronics STM32H5 devices, .obk file loading bug fix
STMicroelectronics STM32U0 devices, programming option bytes bug fix
Texas Instruments MSPM0Lx227 [LQFP48], MSPM0Lx228 [LQFP48], power-up sequence bug fixed
TI (TMS) UCD90160A [QFN64] (P+D), programming bug fixed
Winbond W25Q64RVxxxQ, programming of Status Register bug fixed
XTX XTSDG02GWSIGA [WSON8], adapter test bug fixed